GAMM Student Chapter Bochum

About

Dr. Diehl has been an assistant professor of computational materials science in Leuven since October 2020. Previously, he was group leader for integrated computational materials engineering at the Max Planck Institute for Iron Research in Düsseldorf. His research focuses on microstructure-based simulations of metallic materials using crystal plasticity constitutive models. A central field of work for Dr. Diehl is the development of DAMASK – the Düsseldorf Advanced Material Simulation Kit. DAMASK is an open multiphysics simulation package for crystal plastic material models. It combines numerical solvers, constitutive laws, and tools for preparing and evaluating complex simulations and is used worldwide in research and industry. In his presentation, Dr. Diehl will provide an insight into the DAMASK software and present current developments relating to the platform.

Talk Content

DAMASK is a unified multi-physics crystal plasticity simulation package [1]. The solution of continuum mechanical boundary value problems requires a constitutive response that connects deformation and stress at each material point. This problem is solved in DAMASK on the basis of crystal plasticity using a variety of constitutive models and homogenization approaches. However, treating mechanics in isolation is no longer sufficient to study emergent advanced high-strength materials. In these materials, deformation happens interrelated with displacive phase transformation, significant heating, and potential damage evolution. Therefore, DAMASK is capable of handling multi-physics problems. Following a modular approach, additional field equations are solved in a fully coupled way using a staggered approach.

References

[1] F. Roters, M. Diehl, P. Shanthraj, P. Eisenlohr, C. Reuber, S. L. Wong, T. Maiti, A. Ebrahimi, T. Hochrainer, H.-O. Fabritius, S. Nikolov, M. Friak, N. Fujita, N. Grilli, K. G. F. Janssens, N. Jia, P. J. J. Kok, D. Ma, F. Meier, E. Werner, M. Stricker, D. Weygand, and D. Raabe. Computational Materials Science, 2019, 158:420–478, doi:10.1016/j.commatsci.2018.04.030

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